Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor wafer and method for forming semiconductor

Semiconductor wafer and method for forming semiconductor

US Patent 10410978 · Granted Sep 10, 2019

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Piezoelectric coaxial sensor2025
Cemented carbide and cutting tool2025
Contact2025
Manufacturing method for a substrate wafer2025
Cemented carbide and cutting tool2025
Cleaning device and cleaning method2025
Cemented carbide and cutting tool2025
Wireless power transmitter, wireless power receiver, and wireless power transfer2025
Optical device2025
Secondary battery unit and humanoid robot2025
Combined formulation comprising four linked cytotoxic T lymphocyte (CTL) epitope2025
Automotive door beam made of aluminum alloy extruded material2025