Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Power semiconductor packages having a substrate with two or more metal layers and one or more polymer-based insulating layers for separating the metal layers

Power semiconductor packages having a substrate with two or more metal layers and one or more polymer-based insulating layers for separating the metal layers

US Patent 10410952 · Granted Sep 10, 2019

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electronic devices including electrically insulated load electrodes2023
Power semiconductor module arrangement2020
Semiconductor component and method for contacting said semiconductor component2020
Method for producing an electronic module assembly and electronic module assembl2019
Power semiconductor package having a parallel plate waveguide2019
Circuit arrangement having charge storage units2019
Parallel plate waveguide for power semiconductor package2019
Semiconductor package, assembly and module arrangements for measuring gate-to-em2019
Power semiconductor modules with protective coating2019
Double-encapsulated power semiconductor module and method for producing the same2018
Elastic mounting of power modules2018
Method and drive circuit for driving a transistor2018