Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Control of on-wafer CD uniformity with movable edge ring and gas injection adjustment

Control of on-wafer CD uniformity with movable edge ring and gas injection adjustment

US Patent 10410832 · Granted Sep 10, 2019

Estimated economic value: $48,497,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Pulsing RF coils of a plasma chamber in reverse synchronization2025
Symmetric coupling of coil to direct-drive radiofrequency power supplies2025
Teixobactin analogue and use thereof2025
RF pulsing within pulsing for semiconductor RF plasma processing2025
Systems and methods for achieving peak ion energy enhancement with a low angular2025
Matchless plasma source for semiconductor wafer fabrication2025
Multi-level parameter and frequency pulsing with a low angular spread2024
Semiconductor substrate bevel cleaning2024
Edge ring arrangement with moveable edge rings2024
System and method to adjust a kinetics model of surface reactions during plasma 2024
Systems and methods for achieving peak ion energy enhancement with a low angular2024
Systems for cooling RF heated chamber components2024