Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Systems and methods for reducing coupling noise between propagation lines for die size efficiency

Systems and methods for reducing coupling noise between propagation lines for die size efficiency

US Patent 10403353 · Granted Sep 3, 2019

Estimated economic value: $15,753,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Techniques for performing write operations2025
Delay-locked loop clock sharing2022
Systems and methods for data path power savings in DDR5 memory devices2021
Semiconductor devices having electrostatic discharge layouts for reduced capacit2021
Apparatuses and methods to perform duty cycle adjustment with back-bias voltage2021
Apparatuses and methods to perform duty cycle adjustment with back-bias voltage2021
Reduced shifter memory system2020
Systems and methods for improving output signal quality in memory devices2020
Memory with a reduced array data bus footprint2020
Semiconductor device with pseudo flow through scheme for power savings2020
Semiconductor device with pseudo flow through scheme for power savings2020
Semiconductor device with a time multiplexing mechanism for size efficiency2020