Silver bonding wire for semiconductor device containing indium, gallium, and/or cadmium

Assignee

• Nippon Steel Chemical
• Nippon Micrometal

Inventors

• Tetsuya OYAMADA (21 patents)
• Tomohiro Uno (86 patents)
• Hiroyuki Deai (5 patents)
• Daizo Oda (44 patents)

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