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Home › Integrated circuit package assembly comprising a stack of slanted integrated circuit packages

Integrated circuit package assembly comprising a stack of slanted integrated circuit packages

US Patent 10321580 · Granted Jun 11, 2019

Estimated economic value: $1,829,000 ⓘ

Assignee

IBM

Inventors

Ralph Heller (4 patents)
Patricia M. Sagmeister (33 patents)
Martin Schmatz (105 patents)

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