Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Common procedure of interconnecting electronic chip with connector body and forming the connector body

Common procedure of interconnecting electronic chip with connector body and forming the connector body

US Patent 10319620 · Granted Jun 11, 2019

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Bending semiconductor chip for connection at different vertical levels2023
Semiconductor assembly with conductive frame for I/O standoff and thermal dissip2022
Multi-chip-scale package2014
Semiconductor on semiconductor substrate multi-chip-scale package2013