Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer level packaging for MEMS device

Wafer level packaging for MEMS device

US Patent 10301171 · Granted May 28, 2019

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Physics-guided deep multimodal embeddings for task-specific data exploitation2025
Method of making acoustic devices with directional reinforcement2025
Facilitating access to API integrations2025
Efficient uploading of files to a storage service2025
System and method for simultaneously displaying multiple GUIs via the same displ2025
System and method for efficient visual navigation2025
Interconnection for monolithically integrated stacked devices and methods of for2025
Piezoelectric MEMS microphone with cantilevered separation2025
Acoustic devices with improved sensitivity2025
Piezoelectric sensor with increased sensitivity and devices having the same2025
Electronic acoustic devices, MEMS microphones, and equalization methods2025
Acoustic device with connected cantilever2025