Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Selective metallization of an integrated circuit (IC) substrate

Selective metallization of an integrated circuit (IC) substrate

US Patent 10290557 · Granted May 14, 2019

Estimated economic value: $24,469,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated optical coupler2025
Faraday rotator interconnect as a through-via configuration in a patch architect2025
Position controlled waveguides and methods of manufacturing the same2025
Optical waveguide formed within in a glass layer2025
Hybrid bonding technologies with thermal expansion compensation structures2025
Nested glass packaging architecture for hybrid electrical and optical communicat2025
Microelectronic assemblies including interconnects with different solder materia2025
Microelectronic assemblies including interconnects with different solder materia2025
Steam cleaning apparatus2025
Methods and apparatus to increase glass core thickness2025
Stepped coax MIL PTHS for modulating inductance within a package2025
Embedded faraday rotators and components for increasing bandwidth and/or reducin2025