Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor packages having wire bond wall to reduce coupling

Semiconductor packages having wire bond wall to reduce coupling

US Patent 10269729 · Granted Apr 23, 2019

Estimated economic value: $25,177,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated multiple-path power amplifier2022
Multifunctional radio frequency systems and methods for UV sterilization, air pu2022
Integrally-formed multiple-path power amplifier with on-die combining node struc2022
Digital step attenuator and method for operating a digital step attenuator2022
Power amplifier integrated circuit with integrated shunt-l circuit at amplifier 2022
Power amplifier with integrated bias circuit having multi-point input2021
Multiple-stage power amplifiers and amplifier arrays configured to operate using2021
Multiple-path RF amplifiers with angularly offset signal path directions, and me2021
Integrated multiple-path power amplifier2021
Microelectronic components having integrated heat dissipation posts and systems 2020
Packaged microelectronic component mounting using sinter attachment2020
Multifunctional radio frequency systems and methods for UV sterilization, air pu2020