Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus, system, and method for mitigating warpage of lidless integrated circuits during reflow processes

Apparatus, system, and method for mitigating warpage of lidless integrated circuits during reflow processes

US Patent 10242941 · Granted Mar 26, 2019

Estimated economic value: $3,753,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Intelligent topic segmentation within a communication session2025
Power supply box2025
Power supply box2024
Backup power switching device2024
Sentiment scoring for remote communication sessions2024
Inertia braking test system and control method thereof2024
RV screen door cross bar handle2024
Charging box2024
RV electrical adapter2023
Power inlet box2023
Method and arrangement for manufacturing a graphene film2023
RV electrical adapter2023