Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integration of chip level micro-fluidic cooling in chip packages for heat flux removal

Integration of chip level micro-fluidic cooling in chip packages for heat flux removal

US Patent 10211127 · Granted Feb 19, 2019

Estimated economic value: $133,466,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Ultrasound horn2023
Magnetometer apparatus2021
Magneto-optical detecting apparatus and methods2020
Two-phase fluid-actuated cooling device, system, and method2020
Diamond nitrogen vacancy sensor with nitrogen-vacancy center diamond located bet2019
RF module with integrated waveguide and attached antenna elements and method for2019
Magnetic detection system with highly integrated diamond nitrogen vacancy sensor2019
Bias magnet array for magnetometer2019
Standing-wave radio frequency exciter2019
Vacancy center material with highly efficient RF excitation2019
Optical filtration system for diamond material with nitrogen vacancy centers2019
Micro jet impingement heat sink2019