Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › System and method of embedding driver IC (EmDIC) in LCD display substrate

System and method of embedding driver IC (EmDIC) in LCD display substrate

US Patent 10209542 · Granted Feb 19, 2019

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Interposer structure containing embedded silicon-less link chiplet2025
Encapsulated fan-in semiconductor package with heat spreader and method of manuf2022
Adhesive composition for temporary bonding of semiconductor workpiece and suppor2022
Hermetic flat top integrated heat spreader (IHS)/electromagnetic interference (E2020
Multiple wafers fabrication technique on large carrier with warpage control stif2019
Molded cavity fanout package without using a carrier and method of manufacturing2019
System and method of manufacturing frameless LCD display2019
Wafer-level fan-out wirebond packages2017
Bumpless wafer level fan-out package2017
Silicon-glass hybrid interposer circuitry2016
Integrated circuit package with enhanced thermal conduction2016
Oro and orpro with bit line trench to suppress transport program disturb2016