Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package with a wire bond mesh

Semiconductor package with a wire bond mesh

US Patent 10204842 · Granted Feb 12, 2019

Estimated economic value: $53,310,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor package for stress isolation2025
Integrated circuit package having enhanced thermal dissipation structure2025
Flip chip semiconductor device package with mold compound seal2025
Wire bond damage detector including a detection bond pad over a first and a seco2024
Semiconductor device package with reduced stress2024
Strain-induced shift mitigation in semiconductor packages2024
IC having a metal ring thereon for stress reduction2024
IC having a metal ring thereon for stress reduction2024
Packaged multichip module with conductive connectors2022
Wire bond damage detector including a detection bond pad over a first and a seco2022
Spot-solderable leads for semiconductor device packages2022
Strain-induced shift mitigation in semiconductor packages2022