Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wiring substrate including via interconnect whose side surface includes projection

Wiring substrate including via interconnect whose side surface includes projection

US Patent 10187986 · Granted Jan 22, 2019

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wiring substrate and semiconductor device2017
Wiring substrate, semiconductor device, and method for manufacturing wiring subs2013
Wiring substrate, semiconductor device, and method for manufacturing wiring subs2013