Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit having a component provided by transfer print and method for making the integrated circuit

Integrated circuit having a component provided by transfer print and method for making the integrated circuit

US Patent 10186502 · Granted Jan 22, 2019

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Trench capacitors2025
Trench insulation structure with enlarged electrically conductive side wall2024
Geometrically shaped components in an assembly for a transfer print and associat2023
Semiconductor device along with multi-functional units and method for manufactur2023
Method of manufacturing semiconductor devices to increase yield in micro-transfe2022
Trench insulation structure with enlarged electrically conductive side wall2022
Method for a transfer print between substrates2021
Semiconductor substrate and method for producing a semiconductor substrate2021
Geometrically shaped components in an assembly for a transfer print and associat2020
DMOS transistor having an increased breakdown voltage and method for production2015
High-voltage power transistor using SOI technology2014
MOS-power transistors with edge termination with small area requirement2014