Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package with grounded fence to inhibit dendrites of die-attach materials

Semiconductor package with grounded fence to inhibit dendrites of die-attach materials

US Patent 10186476 · Granted Jan 22, 2019

Estimated economic value: $12,854,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electronic component with lid to manage radiation feedback2025
Electronic package with interposer between integrated circuit dies2024
Electronic component with lid to manage radiation feedback2024
Packaged transistor having die attach materials with channels and process of imp2023
Integrated circuit self-monitored burn-in2013
Four piece table tennis table having a stabilized joint2010