Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device that includes a molecular bonding layer for bonding of elements

Semiconductor device that includes a molecular bonding layer for bonding of elements

US Patent 10163765 · Granted Dec 25, 2018

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wireless apparatus2020
Wireless apparatus2019
Method for forming metal wiring2019
Metal pattern forming method2018
Wireless apparatus2017
Electronic component and electronic unit2017
Semiconductor device and method for manufacturing the same2016
Printed wiring board2016
Apparatus for manufacturing flexible printed wiring board, apparatus for manufac2015
Semiconductor device and method for manufacturing the same2014
Television receiver and electronic device2014
Electronic apparatus2014