{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "System for over-molded PCB sealing ring for TEC heat exchangers", "item": "https://www.patentleaderboard.com/patent/10161642"}]}

Home › System for over-molded PCB sealing ring for TEC heat exchangers

System for over-molded PCB sealing ring for TEC heat exchangers

US Patent 10161642 · Granted Dec 25, 2018

Assignee

Marlow Industries

Inventors

Michael Giraud (2 patents)
Jeremy Mishler (1 patents)

View full patent text on Google Patents →