Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Contact area design for solder bonding

Contact area design for solder bonding

US Patent 10157874 · Granted Dec 18, 2018

Estimated economic value: $1,174,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device and method of manufacturing the same2025
Package structure2025
Integrated circuit package and method2025
Method and apparatus for removing contamination2025
Fingerprint sensor device and method2025
Fingerprint sensor device and method2025
Chip package structure with metal-containing layer2025
Semiconductor package and manufacturing method thereof2025
Semiconductor device structure with magnetic element2025
Semiconductor device and method2025
IPD modules with flexible connection scheme in packaging2025
Package structure and method of forming the same2025