In mold electronic printed circuit board encapsulation and assembly

Assignee

• Covestro
• Thermal Solution Resources

Inventors

• Terry G. Davis (4 patents)
• David Rocco (4 patents)
• Mikhail Sagal (4 patents)
• Jessee McCanna (4 patents)
• Nicolas Sunderland (4 patents)
• James M. Lorenzo (9 patents)
• Mark M. Matsco (12 patents)
• Kevin Dunay (4 patents)

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