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Home › Use of epoxy film adhesive with high ink compatibility and thermal oxidative stability for printhead interstitial bonding in high density printheads

Use of epoxy film adhesive with high ink compatibility and thermal oxidative stability for printhead interstitial bonding in high density printheads

US Patent 10150898 · Granted Dec 11, 2018

Estimated economic value: $8,369,000 ⓘ

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