Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › TSV layout structure and TSV interconnect structure, and fabrication methods thereof

TSV layout structure and TSV interconnect structure, and fabrication methods thereof

US Patent 10141244 · Granted Nov 27, 2018

Estimated economic value: $2,693,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Air conditioner and data transmission method based on power line communication t2025
Power line communication-based pairing method and device for air conditioner, an2025
Method and apparatus for processing scanning, device, and medium2025
Device and method for diagnosing and configuring a hydraulic device based on wir2025
Method and apparatus for monitoring scanning rod status, storage medium, and ele2025
Antenna2025
Method and apparatus for processing scanning data, device, and medium2025
Optoelectronic semiconductor chip and method for producing optoelectronic semico2025
Dental scanner2025
Slicing machine2025
Dental scanner2025
Preparation method of polymer-derived high-temperature ceramic film sensor2025