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Home › Metal shield trenches and metal substrate contacts supported within the premetallization dielectric (PMD) layer of an integrated circuit using a middle end of line (MEOL) process

Metal shield trenches and metal substrate contacts supported within the premetallization dielectric (PMD) layer of an integrated circuit using a middle end of line (MEOL) process

US Patent 10128295 · Granted Nov 13, 2018

Estimated economic value: $4,486,000 ⓘ

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