Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Pad structure for backside illuminated (BSI) image sensors

Pad structure for backside illuminated (BSI) image sensors

US Patent 10109666 · Granted Oct 23, 2018

Estimated economic value: $4,605,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Package structure and manufacturing method thereof2025
Package structure and manufacturing method thereof2025
Titanium layer as getter layer for hydrogen in a MIM device2024
Integrated heater (and related method) to recover degraded piezoelectric device 2024
Integrated heater (and related method) to recover degraded piezoelectric device 2023
Waveguide structure and manufacturing method of the same2022
Titanium layer as getter layer for hydrogen in a MIM device2022
Method and apparatus for CMOS sensor packaging2022
Reduction of electric field enhanced moisture penetration by metal shielding2022
Method of manufacturing image sensor2021
Method of manufacturing image sensor2021
MEMS devices and methods of forming the same2021