Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Package with embedded electronic components and a waveguide cavity through the package cover, antenna apparatus including package, and method of manufacturing the same

Package with embedded electronic components and a waveguide cavity through the package cover, antenna apparatus including package, and method of manufacturing the same

US Patent 10109604 · Granted Oct 23, 2018

Estimated economic value: $1,058,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Microwave antenna apparatus, packing and manufacturing method2021
Cross-shaped antenna array2021
Surveillance apparatus having an optical camera and a radar sensor2020
Method for generating an image and handheld screening device2020
Security system, method and device2020
Microwave antenna apparatus, packing and manufacturing method2019
Microwave antenna apparatus, packing and manufacturing method2019
Planar antenna array2019
Surveillance apparatus having an optical camera and a radar sensor2019
Method for operating a handheld screening device and a handheld screening device2019
Surveillance apparatus having an optical camera and a radar sensor2018
Antenna array and method2018