Wiring substrate and manufacturing method of wiring substrate

Assignee

• Fujitsu Limited
• Sony

Inventors

• Kei Fukui (7 patents)
• Kazuya Arai (9 patents)
• Koji Komemura (4 patents)
• Kazuhiko Iijima (7 patents)
• Kenichiro Abe (50 patents)
• Shinji Rokuhara (12 patents)
• Shuichi Oka (25 patents)

View full patent text on Google Patents →