Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit die having a split solder pad

Integrated circuit die having a split solder pad

US Patent 10096561 · Granted Oct 9, 2018

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Soft switching device, electronic system with soft switching device with an elec2025
Tamper-evident RFID tag and method thereof2025
System with a low-drift on-chip oscillator with lowered sensitivity to random te2025
Integrated circuit die having a split solder pad2019
Integrated circuit die having a split solder pad2019
Method for manufacturing humidity sensor2019
Active transponder with very low electric power consumption in standby mode2013
Power supply arrangement for battery powered device2007
Microelectromechanical system2007