High planarization efficiency chemical mechanical polishing pads and methods of making

Assignee

• Rohm And Haas Electronic Materials Cmp Holdings
• Dow Global Technologies

Inventors

• Jonathan G. Weis (7 patents)
• George C. Jacob (33 patents)
• Bhawesh Kumar (7 patents)
• Sarah E. Mastroianni (2 patents)
• Wenjun Xu (10 patents)
• Nan-Rong Chiou (15 patents)
• Mohammad T. Islam (11 patents)

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