Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Package-on-package type semiconductor package and method of fabricating the same

Package-on-package type semiconductor package and method of fabricating the same

US Patent 10068881 · Granted Sep 4, 2018

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor package system2025
Electronic device and operating method2024
Semiconductor package including dual stiffener2024
Hybrid semiconductor device and electronic device2024
Semiconductor package system2023
Semiconductor module including multiple power management semiconductor packages2023
Semiconductor package system2022
Semiconductor package system2021
Semiconductor package2021
Semiconductor package system2021
Surface temperature management method of mobile device and memory thermal manage2019
Chip using triple pad configuration and packaging method thereof2018