Electrodeposition method for preparing polycrystalline copper having improved mechanical and physical properties

Assignee

• Integran Technologies

Inventors

• Gino Palumbo (51 patents)
• Iain Brooks (14 patents)
• Klaus Tomantschger (77 patents)
• Peter Lin (9 patents)
• Karl Aust (2 patents)
• Nandakumar Nagarajan (11 patents)
• Francisco Gonzalez (20 patents)

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