Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Optical chip-scale package for use in a high channel density, high data rate data communications system having optical input/output (I/O) ports

Optical chip-scale package for use in a high channel density, high data rate data communications system having optical input/output (I/O) ports

US Patent 10054749 · Granted Aug 21, 2018

Estimated economic value: $93,537,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method forming gate stacks adopting thin silicon cap2025
Methods to apply microlens on small aperture photodetectors and VCSEL for high d2025
Metal gate fill for short-channel and long-channel semiconductor devices2021
Optical devices with bandwidth enhancing structures2020
Optical device and system having thermal buffers2020
Optical device and system having an array of addressable apertures2019
Optical device and system having an array of addressable apertures2019
Passive alignment system and an optical communications module that incorporates 2018
Passive alignment system and an optical communications module that incorporates 2018
Multi-channel optical wavelength division multiplexing/demultiplexing (WDM) asse2018
Multi-channel optical wavelength division multiplexing/demultiplexing (WDM) asse2018
Nanoporous thin film and method for fabricating the same2018