Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Dual solder layer for fluidic self assembly and electrical component substrate and method employing same

Dual solder layer for fluidic self assembly and electrical component substrate and method employing same

US Patent 10039194 · Granted Jul 31, 2018

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Optoelectronic semiconductor device and glasses2025
Organic anti-reflective coating for visible and IR optical components for emissi2025
Semiconductor light source with a mirror coating and method2025
Method for producing a planar light circuit and planar light circuit2024
Process of manufacturing a conversion element, conversion element and light emit2023
Optoelectronic component and method for producing an optoelectronic component2023
Methods for producing a conversion element and an optoelectronic component2022
Optoelectronic light source and data glasses2022
Aperiodic nano-optical array for angular shaping of incoherent emissions2022
Process of manufacturing a conversion element, conversion element and light emit2022
Optoelectronic light source2022
Multilayer ceramic converter with stratified scattering2021