Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Structures for reducing and avoiding stresses on the seal bottom side during laser reseal

Structures for reducing and avoiding stresses on the seal bottom side during laser reseal

US Patent 10023460 · Granted Jul 17, 2018

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Micromechanical component for a rotation rate sensor2025
Micromechanical component for a sound transducer and corresponding production me2025
Micromechanical sensor structure with damping structure2025
Sensor device for measuring a temperature difference in a computer chip system2025
Method for producing a bonding pad for a micromechanical sensor element2025
Micromechanical component for a sensor device2025
Method for manufacturing a MEMS switch having an embedded metal contact2025
MEMS relay2025
Micromechanical component for a pressure and inertial sensor device2024
Device for detecting sound in the surroundings of an automobile2024
Micromechanical sensor device and corresponding production method2024
Capacitively operable MEMS switch2024