Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods for chemical mechanical polishing (CMP) processing with ozone

Methods for chemical mechanical polishing (CMP) processing with ozone

US Patent 10002771 · Granted Jun 19, 2018

Estimated economic value: $36,553,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Self-aligned wide backside power rail contacts to multiple transistor sources2025
Self-aligned wide backside power rail contacts to multiple transistor sources2025
Water vapor plasma to enhance surface hydrophilicity2025
Water vapor plasma to enhance surface hydrophilicity2025
Water vapor plasma to enhance surface hydrophilicity2025
Electroplating wetting chamber with reduced bubble entrapment2025
Silicon (Si) dry etch for die-to-wafer thinning2025
Silicon (Si) dry etch for die-to-wafer thinning2025
Silicon (Si) dry etch for die-to-wafer thinning2025
Procedure to enable die rework for hybrid bonding2025
Electrochemical depositions of nanotwin copper materials2025
Electrochemical depositions of nanotwin copper materials2025