Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6284108 | Method and apparatus for momentum plating | — | 2001-09-04 |
| 6096982 | Method and apparatus for conductively joining components | — | 2000-08-01 |
| 5835359 | Electrical interconnect using particle enhanced joining of metal surfaces | — | 1998-11-10 |
| 5670251 | Patternable particle filled adhesive matrix for forming patterned structures between joined surfaces | — | 1997-09-23 |
| 5642055 | Electrical interconnect using particle enhanced joining of metal surfaces | — | 1997-06-24 |
| 5634265 | Electrical interconnect using particle enhanced joining of metal surfaces | — | 1997-06-03 |
| 5565280 | Electrical interconnect using particle enhanced joining of metal surfaces | — | 1996-10-15 |
| 5506514 | Electrical interconnect using particle enhanced joining of metal surfaces | — | 1996-04-09 |
| 5471151 | Electrical interconnect using particle enhanced joining of metal surfaces | — | 1995-11-28 |
| 5430614 | Electrical interconnect using particle enhanced joining of metal surfaces | — | 1995-07-04 |
| 5334809 | Particle enhanced joining of metal surfaces | — | 1994-08-02 |
| 5083697 | Particle-enhanced joining of metal surfaces | — | 1992-01-28 |
| 4804132 | Method for cold bonding | — | 1989-02-14 |