CB

Chad Byers

PA Parasoft: 2 patents #12 of 53Top 25%
IN Intel: 1 patents #18,218 of 30,777Top 60%
Overall (All Time): #1,442,142 of 4,157,543Top 35%
3
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11189487 Method and apparatus for high pressure cure of flowable dielectric films Jonathan Leonard, Aravind S. Killampalli, Jay P. Gupta 2021-11-30
7392507 Modularizing a computer program for testing and debugging Adam K. Kolawa 2008-06-24
6895578 Modularizing a computer program for testing and debugging Adam K. Kolawa 2005-05-17