Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9960325 | Lead, wiring member, package part, metal part provided with resin and resin-sealed semiconductor device, and methods for producing same | Takahiro Fukunaga | 2018-05-01 |
| 8946746 | Lead, wiring member, package part, metal part provided with resin and resin-sealed semiconductor device, and methods for producing same | Takahiro Fukunaga | 2015-02-03 |
| 8110904 | Lead frame for semiconductor device and method of manufacturing of the same | Takahiro Fukunaga | 2012-02-07 |