Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12286500 | Resin composition, prepreg, resin-equipped film, resin- equipped metal foil, metal-clad laminate, and wiring board | Hiroyuki Fujisawa, Akira Otsuka, Koichi Isaji, Hajime Ogushi | 2025-04-29 |