Issued Patents All Time
Showing 76–100 of 109 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7166908 | Optical device | Eizou Fujii, Toshiyuki Fukuda | 2007-01-23 |
| 7154156 | Solid-state imaging device and method for producing the same | Mutsuo Tsuji, Kouichi Yamauchi | 2006-12-26 |
| 7153042 | Optic device | Tetsushi Nishio, Toshiyuki Fukuda | 2006-12-26 |
| 7132315 | Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same | Hiroshi Horiki, Tetsushi Nishio | 2006-11-07 |
| 7126209 | Lead frame, resin-encapsulated semiconductor device, and method of producing the same | Haruto Nagata, Tetsushi Nishio | 2006-10-24 |
| 7049684 | Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the same | Hiroshi Horiki, Toshiyuki Fukuda | 2006-05-23 |
| 7042071 | Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same | Hiroshi Horiki, Tetsushi Nishio | 2006-05-09 |
| 7026192 | Terminal land frame and method for manufacturing the same | Osamu Adachi, Toru Nomura | 2006-04-11 |
| 6984880 | Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device | Fumihiko Kawai, Masahiko Ohiro, Masanori Koichi, Yoshinori Satoh, Akira Oga +1 more | 2006-01-10 |
| 6909168 | Resin encapsulation semiconductor device utilizing grooved leads and die pad | Toru Nomura | 2005-06-21 |
| D505964 | Image sensor | Yoshinobu Kunitomo, Mutsuo Tsuji, Koichi Yamauchi | 2005-06-07 |
| 6900524 | Resin molded semiconductor device on a lead frame and method of manufacturing the same | Satoru Konishi, Yoshihiko Morishita, Yuichiro Yamada, Fumito Itoh | 2005-05-31 |
| 6897428 | Solid-state imaging device and method for manufacturing the same | Tetsushi Nishio, Toshiyuki Fukuda | 2005-05-24 |
| 6864117 | Method for producing solid-state imaging device | Hiroshi Horiki, Tetsushi Nishio | 2005-03-08 |
| 6861734 | Resin-molded semiconductor device | Osamu Adachi | 2005-03-01 |
| 6861735 | Resin molded type semiconductor device and a method of manufacturing the same | Satoru Konishi, Yoshihiko Morishita, Yuichiro Yamada, Fumito Itoh | 2005-03-01 |
| D501664 | Image sensor | Yoshinobu Kunitomo, Mutsuo Tshuji, Koichi Yamauchi | 2005-02-08 |
| 6720207 | Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device | Fumihiko Kawai, Masahiko Ohiro, Masanori Koichi, Yoshinori Satoh, Akira Oga +1 more | 2004-04-13 |
| 6710430 | Resin-encapsulated semiconductor device and method for manufacturing the same | Toru Nomura, Fumihiko Kawai | 2004-03-23 |
| 6692991 | Resin-encapsulated semiconductor device and method for manufacturing the same | Toru Nomura | 2004-02-17 |
| 6680220 | Method of embedding an identifying mark on the resin surface of an encapsulated semiconductor package | Hiroaki Fujimoto, Ryuichi Sahara, Toshiyuki Fukuda, Toru Nomura | 2004-01-20 |
| 6680524 | Semiconductor device and method for fabricating the same | Hiroaki Fujimoto, Ryuichi Sahara, Toshiyuki Fukuda, Toru Nomura | 2004-01-20 |
| 6674154 | Lead frame with multiple rows of external terminals | Toru Nomura, Fumihiko Kawai | 2004-01-06 |
| 6667541 | Terminal land frame and method for manufacturing the same | Osamu Adachi, Toru Nomura | 2003-12-23 |
| 6650020 | Resin-sealed semiconductor device | Yuichiro Yamada | 2003-11-18 |