Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8176782 | Capacitive sensor | Eiichi Furukubo, Daisuke Wakabayashi, Masao Ohbuchi, Ryo Aoki | 2012-05-15 |
| 8080869 | Wafer level package structure and production method therefor | Takafumi Okudo, Yuji Suzuki, Yoshiyuki Takegawa, Toru Baba, Kouji Gotou +2 more | 2011-12-20 |
| 8067769 | Wafer level package structure, and sensor device obtained from the same package structure | Takafumi Okudo, Yuji Suzuki, Yoshiyuki Takegawa, Toru Baba, Kouji Gotou +2 more | 2011-11-29 |
| 8026594 | Sensor device and production method therefor | Takafumi Okudo, Yuji Suzuki, Yoshiyuki Takegawa, Toru Baba, Kouji Gotou +2 more | 2011-09-27 |
| 7674638 | Sensor device and production method therefor | Takafumi Okudo, Yuji Suzuki, Yoshiyuki Takegawa, Toru Baba, Kouji Gotou +2 more | 2010-03-09 |
| 7554340 | Capacitive sensor | Eiichi Furukubo | 2009-06-30 |
| 7107847 | Semiconductor acceleration sensor and method of manufacturing the same | Hitoshi Yoshida, Kazushi Kataoka, Sumio Akai, Daisuke Wakabayashi, Koji Goto +1 more | 2006-09-19 |
| 6848320 | Mechanical deformation amount sensor | Masao Arakawa, Akira Yabuta, Jun Sakai | 2005-02-01 |
| 5151602 | Semiconductor relay circuit using photovoltaic diodes | Yukio Idaka, Shuichiroh Yamaguchi, Takeshi Matsumoto, Yasunori Miyamoto | 1992-09-29 |