Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11345784 | Resin composition, and resin film, metal foil with resin, metal clad laminate, wiring board, and circuit mount component using same | Kyosuke MICHIGAMI, Tomoaki Sawada, Tomohiro Fukao, Takatoshi Abe | 2022-05-31 |