Issued Patents All Time
Showing 26–50 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10206288 | Bare die integration with printed components on flexible substrate | Ping Mei, Brent S. Krusor | 2019-02-12 |
| 10199586 | Device comprising dielectric interlayer | Guiqin Song, Ping Mei, Nan-Xing Hu, Biby Esther Abraham | 2019-02-05 |
| 10186158 | Automated air traffic communications | James Burgess, Chirath Neranjena Thouppuarachchi | 2019-01-22 |
| 10178447 | Sensor network system | David Eric Schwartz, Tse Nga Ng, Anurag Ganguli, George Daniel | 2019-01-08 |
| 10165677 | Bare die integration with printed components on flexible substrate without laser cut | Ping Mei, Tse Nga Ng, Brent S. Krusor, Steven E. Ready, Janos Veres | 2018-12-25 |
| 10026579 | Self-limiting electrical triggering for initiating fracture of frangible glass | Scott Limb, Christopher L. Chua, Sean Garner, Sylvia Joan Smullin, Qian Wang +1 more | 2018-07-17 |
| 10014261 | Microchip charge patterning | Eugene M. Chow, JengPing Lu, Armin R. Volkel, Bing R. Hsieh | 2018-07-03 |
| 10012250 | Stress-engineered frangible structures | Scott Limb | 2018-07-03 |
| 9952082 | Printed level sensor | David Eric Schwartz, Yunda Wang, Robert A. Street, Ping Mei, Janos Veres +2 more | 2018-04-24 |
| 9886862 | Automated air traffic communications | James Burgess, Chirath Neranjena Thouppuarachchi | 2018-02-06 |
| 9780044 | Transient electronic device with ion-exchanged glass treated interposer | Scott Limb | 2017-10-03 |
| 9629252 | Printed electronic components on universally patterned substrate for integrated printed electronics | Ping Mei, Tse Nga Ng | 2017-04-18 |
| 9594039 | Photometric enthalpy change detection system and method | Michael I. Recht, Joerg Martini, Francisco E. Torres | 2017-03-14 |
| 9579904 | System and method for thermal transfer of thick metal lines | Timothy Stowe | 2017-02-28 |
| 9473047 | Method for reduction of stiction while manipulating micro objects on a surface | Jason Thompson, Eugene M. Chow, JengPing Lu, David K. Biegelsen, Janos Veres | 2016-10-18 |
| 9431283 | Direct electrostatic assembly with capacitively coupled electrodes | Jason Thompson, Eugene M. Chow, JengPing Lu, David K. Biegelsen, Janos Veres | 2016-08-30 |
| 9396972 | Micro-assembly with planarized embedded microelectronic dies | Rene A. Lujan | 2016-07-19 |
| 9356603 | Thermally tempered glass substrate using CTE mismatched layers and paste mixtures for transient electronic systems | Scott Limb, Sean Garner | 2016-05-31 |
| 9356248 | Organic thin-film transistor | Tse Nga Ng, Ichiro Fujieda, Bing R. Hsieh | 2016-05-31 |
| 9305807 | Fabrication method for microelectronic components and microchip inks used in electrostatic assembly | Rene A. Lujan, Eugene M. Chow, JengPing Lu | 2016-04-05 |
| 9219126 | High-k dielectrics with a low-k interface for solution processed devices | Tse Nga Ng, Bing R. Hsieh | 2015-12-22 |
| 9154138 | Stressed substrates for transient electronic systems | Scott Limb, Sean Garner, JengPing Lu, Dirk DeBruyker | 2015-10-06 |
| 8884156 | Solar energy harvesting device using stimuli-responsive material | Philipp H. Schmaelzle, Joerg Martini, David K. Fork, Patrick Y. Maeda | 2014-11-11 |
| 8872224 | Solution Processed Neutron Detector | Tse Nga Ng, Janos Veres, Robert A. Street | 2014-10-28 |
| 8735871 | Organic thin film transistors | Jonathan Halls, Craig Murphy, Kaname Ito | 2014-05-27 |