Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12426408 | Optoelectronic semiconductor component | Michael Binder, Andreas Rückerl, Tobias Meyer, Kerstin Neveling, Christine Rafael +3 more | 2025-09-23 |
| 12405101 | Hybrid wire localization length measurement device | Eoin Conor O'Farrell, Roman Lutchyn, Tom Marijn LAEVEN, Kevin Alexander VAN HOOGDALEM, Naganivetha Thiyagarajah +2 more | 2025-09-02 |
| 12356762 | Optoelectronic component and method for producing an optoelectronic component | Michael Binder, Andreas Rückerl | 2025-07-08 |
| 11796567 | Method and device for electrically contacting components in a semiconductor wafer | Michael Bergler | 2023-10-24 |
| 11378590 | Device and method for processing a multiplicity of semiconductor chips | Michael Bergler | 2022-07-05 |
| 11011573 | Radiation-emitting component | — | 2021-05-18 |
| 10872783 | Method for structuring a nitride layer, structured dielectric layer, optoelectronic component, etching method for etching layers, and an environment sensor | Andreas Rueckerl, Simeon Katz | 2020-12-22 |
| 10867873 | Method and device for measurement of a plurality of semiconductor chips in a wafer array | Holger Specht, Anton Vogl, Jens Ebbecke | 2020-12-15 |
| 10651342 | Optoelectronic semiconductor chip | Michael Binder, Jens Ebbecke, Tobias Meyer | 2020-05-12 |
| 10580938 | Light-emitting diode chip, and method for manufacturing a light-emitting diode chip | Jens Ebbecke, Petrus Sundgren | 2020-03-03 |
| 10566210 | Method for structuring a nitride layer, structured dielectric layer, optoelectronic component, etching method for etching layers, and an environment sensor | Andreas Rueckerl, Simeon Katz | 2020-02-18 |
| 10288671 | Method and device for inspecting an optoelectronic component arranged on a connection board | Robert Schulz, Anton Vogl | 2019-05-14 |
| 10132855 | Method and device for measuring and optimizing an optoelectronic component | Robert Schulz, Anton Vogl, Raimund Oberschmid, Michael Dietz | 2018-11-20 |
| 9853018 | Optoelectronic semiconductor chip and optoelectronic component | Christian Leirer, Berthold Hahn, Johannes Baur, Karl Engl | 2017-12-26 |
| 7741227 | Process for structuring at least one year as well as electrical component with structures from the layer | Maja Hackenberger, Johannes Voelkl | 2010-06-22 |