MA

Mohd Helmy Bin Ahmad

OE Orthodyne Electronics: 1 patents #13 of 26Top 50%
SC Stats Chippac: 1 patents #282 of 425Top 70%
📍 Johor Bahru, MY: #27 of 61 inventorsTop 45%
Overall (All Time): #3,368,721 of 4,157,543Top 85%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7443018 Integrated circuit package system including ribbon bond interconnect You Yang Ong, Kwang Yong Chung, Garrett Leigh Wong, Christoph B. Luechinger 2008-10-28