Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11971575 | Integrated bandgap temperature sensor | John Parker | 2024-04-30 |
| 11699677 | Die-to-wafer bonding utilizing micro-transfer printing | Roberto Marcoccia | 2023-07-11 |
| 11536899 | Integrated bandgap temperature sensor | John Parker | 2022-12-27 |
| 11499923 | On-chip photonic integrated circuit optical validation | — | 2022-11-15 |
| 11428646 | Loss monitoring in photonic circuit fabrication | Erik Johan Norberg, Rui Liang, Jared Bauters | 2022-08-30 |