Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10632517 | Crimp structure, crimping method, and electronic device | Eiji Teramoto, Hitoshi Nakano, Kazuyoshi Nishikawa | 2020-04-28 |
| 10471660 | Manufacturing method of bonding structure and bonding structure | Kazuyoshi Nishikawa, Akio Sumiya, Satoshi Hirono | 2019-11-12 |
| 10449698 | Bonded structure and method for producing bonded structure | Kazuyoshi Nishikawa, Akio Sumiya, Satoshi Hirono, Hiroshige Uematsu | 2019-10-22 |
| 9793637 | Crimp structure, crimping method, and electronic device | Eiji Teramoto, Hitoshi Nakano, Kazuyoshi Nishikawa | 2017-10-17 |