Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157943 | Trenched-bonding-dam device and manufacturing method for same | Teng-Sheng Chen, Kuei-Cheng Liang, Chia-Yang Chang | 2018-12-18 |
| 9450004 | Wafer-level encapsulated semiconductor device, and method for fabricating same | Wei-Feng Lin | 2016-09-20 |