Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9653416 | Semiconductor substrate and manufacturing method thereof | Hisashi Ishida, Yoshiaki Takemoto | 2017-05-16 |
| 9425135 | Electrode body, wiring substrate, and semiconductor device | Hiroshi Kikuchi, Yoshiaki Takemoto | 2016-08-23 |
| 9111923 | Wiring substrate having conductive bumps with resin sealing between bumps and method of making | Hiroshi Kikuchi, Yoshiaki Takemoto, Yoshitaka Tadaki | 2015-08-18 |
| 9035470 | Substrate and semiconductor device | Yoshiaki Takemoto, Yuichi Gomi, Hiroshi Kikuchi | 2015-05-19 |