Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7514768 | Package structure for a semiconductor device incorporating enhanced solder bump structure | — | 2009-04-07 |
| 7414304 | Semiconductor device | — | 2008-08-19 |
| 7208844 | Semiconductor device | — | 2007-04-24 |
| 7123480 | Package structure for a semiconductor device | — | 2006-10-17 |
| 6929979 | Method for packaging semiconductor device | — | 2005-08-16 |
| 6773966 | Method of manufacturing semiconductor device | — | 2004-08-10 |
| 6674163 | Package structure for a semiconductor device | — | 2004-01-06 |
| 6627988 | Semiconductor device and method for manufacturing the same | — | 2003-09-30 |